Egan Food Technologies will give customers their first look at its new, USA-made cooling tunnel at Pack Expo in Las Vegas. The introduction of this equipment complements the company’s core product lines and allows Egan Food Technologies the ability to offer more complete turn-key solutions. Like so many of its offerings, the cooling tunnel was introduced after numerous customers expressed a strong desire for locally built equipment in order to eliminate the hassles of sourcing and servicing equipment from overseas vendors.
While each tunnel can be custom-built to meet process needs, the equipment was engineered using all current industry best practices for cooling cookies, bars, molded chocolate, and enrobed confections. Additional applications for the tunnel include quick-cooling of brownies, candy, coated popcorn, snack cakes, pies, rolls, fruits, vegetables, pet food, and non-food related products.
The tunnel is constructed entirely of stainless steel and features components such as chilled deck plates and air flow divider shelves that can be removed without the use of tools for quick and easy sanitation. Available in widths up to 48 inches, the tunnel uses a modular design to accommodate varying cooling requirements and production line lengths. Its adjustable cooling profile allows for either radiant or convection applications.
Egan Food Technologies offers a test unit for analysis of customer’s cooling needs. Customers can send products or recipes to Egan Food Technologies for testing, or Egan Food Technologies can bring the unit to the customer’s facility for on-site data collection. Whether testing remotely or on site, customers will receive crucial data on their products’ precise cooling profile(s).
For more on the Egan Food Technologies’ Cooling Tunnel, visit Pack Expo booth #7110, located in the Confectionary Pavilion in Las Vegas, September 25-27, 2017. To schedule a cooling test or an appointment during the show, contact Mike Bond at 616.419.2799 or email@example.com. Use code 27R71 for free registration to Pack Expo.